Samsung has announced the development of a low-power compression attached memory module (LPCAMM), which it claims is the first of its kind in the industry and will be integrated into Intel platforms in 2024. LPCAMM combines the advantages of LPDDR DRAM and DDR-based So-DIMMs by being compact and detachable. This innovation is expected to revolutionize the DRAM market for PCs, laptops, and potentially even data centers. While LPDDR offers compactness, it is permanently attached to the motherboard. On the other hand, So-DIMMs can be detached but have limitations in performance and physical design. LPCAMM bridges this gap by providing a detachable yet compact form factor, offering enhanced flexibility for PC and laptop manufacturers during production.
The LPCAMM module takes up 60% less mounted surface area on the motherboard compared to So-DIMM, while improving performance by up to 50% and power efficiency by up to 70%, according to Samsung. This new form factor also appeals to data centers and servers due to their interest in LPDDR’s power efficiency, but the permanent attachment of LPDDR to motherboards has been a drawback during upgrades. However, LPCAMM provides a solution by combining power efficiency with detachability. Samsung is collaborating with Intel and other major customers to test LPCAMM on next-generation PC systems and plans to launch it in 2024.
In summary, Samsung’s new LPCAMM module is a breakthrough in memory technology, offering a compact yet detachable form factor that combines the advantages of LPDDR DRAM and So-DIMMs. This innovation is set to transform the DRAM market for PCs, laptops, and potentially data centers by providing enhanced flexibility for manufacturers and improving performance and power efficiency. With the support of Intel and other partners, Samsung plans to launch LPCAMM on next-generation PC systems in 2024.